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Title: High bonding temperatures greatly improve soy adhesive wet strength

Source: Polymers 2016, 8, 394:1-10

Author(s)Frihart, Charles R.; Coolidge, Thomas; Mock, Chera; Valle, Eder

Publication Year: 2016  View PDF »

Category: Journal Articles
Associated Research Project(s):   FPL-4707-1B

Abstract: Soy wood adhesive bond strengths reported in different literature studies are difficult to compare because a variety of temperatures and other conditions have been used for the bonding and testing step. Some reports have indicated bond strengths are sensitive to bonding temperature, but the reason(s) for this has not been intensively investigated. Although these prior studies differ in other ways (such as type of soy, wood species, and test method), the effect of bonding temperature has not been clearly examined, which is important for focusing commercial applications. A tensile shear test using two-parallel-ply veneer specimens with smooth maple was used to measure both the dry and the wet cohesive strength of soy adhesives. Although the soy adhesives gave very good strength and dry wood failure, they often have low wood failure and shear strengths when under wet conditions when bonded at 120ºC. However, wet strength greatly increased as the bonding temperature increased (120, 150, and 180ºC) for these two-ply tests with. This study examined the use of different types of soys (flours, concentrates, and isolates) and different bonding temperatures and bonding conditions to evacuate several possible mechanisms for this temperature sensitivity, with coalescence being the most likely.

Keywords: soy; flour; concentrate; isolate; wet shear strength; bonding temperature

Publication Review Process: Formally Refereed

File size: 400 kb(s)

Date posted: 02/02/2017

This publication is also viewable on Treesearch:  view
RITS Product ID: 84013
Current FPL Scientist associated with this product
Frihart, Charles R.
Research Chemist
  

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