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Title: Dielectric Damage

Source: ECS Transactions, Volume 60, Number 1, 2014; pp. 733-738.

Author(s)Shohet, J.L.; Lin, Q.; King, S.W.; Ren, H.; Banna, S.; Jakes, J.E.; Agasie, R.J.; Naik, M.; Nishi, Y.; Nichols, M.T.; Mavrakakis, K.; Hsu, K.; Guo, X.; Pei, D.; Li, W.; Choudhury, F.; Zheng, H.

Publication Year: 2014  View PDF »

Category: Journal Articles
Associated Research Project(s):   FPL-4707-3B

Abstract: More and more high- and low-k dielectrics are used in microfabrication today. However, as is well known, these materials are easily damaged during processing or during operation in a device. Sources of damage include plasma and/or VUV exposure, water uptake, free radicals as well as cosmic rays. A description of the damage effects on dielectrics from water uptake, plasma and/or VUV exposure, and neutron exposure is presented. Although the results for neutron exposure are presented for a high-k dielectric, HfO2, they can easily be extended to low-k dielectrics.

Keywords: nanoindentation; thin film; humidity

Publication Review Process: Non-Refereed (Other)

File size: 267 kb(s)

Date posted: 09/09/2014
RITS Product ID: 68700
Current FPL Scientist associated with this product
Jakes, Joseph
Research Materials Engineer

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