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Title: The effect of water uptake on the mechanical properties of low-k organosilica glass

Source: J. Appl. Phys. Volume 114, 2013; pp. 084103-1 to 084103-11.

Author(s)Guo, X.; Jakes, J.E.; Nichols, M.T.; Banna, S.; Nishi, Y.; Shohet, J.L.

Publication Year: 2013  View PDF »

Category: Journal Articles
Associated Research Project(s):   FPL-4707-3B

Abstract: Water uptake in porous low-k dielectrics has become a significant challenge for both back-end-of line integration and circuit reliability. The influence of absorbed water on the mechanical properties of plasma-enhanced chemical-vapor-deposited organosilicate glasses (SiCOH) was investigated with nanoindentation. The roles of physisorbed (α-bonded) and chemisorbed (β-bonded) water were examined separately through annealing at different temperatures. Nanoindentation measurements were performed on dehydrated organosilicate glass during exposure to varying humidity conditions. The elastic modulus and hardness for as-deposited SiCOH are intimately linked to the nature and concentration of the absorbed water in the dielectric. Under mild-annealing conditions, the water-related film mechanical property changes were shown to be reversible. The mechanical properties of UV-cured SiCOH were also shown to depend on absorbed water, but to a lesser extent because UV curing depopulates the hydrophilic chemical groups in SiCOH. High-load indentation tests showed that in-diffusion of water in the film/substrate interface can degrade the hardness of SiCOH/Si film stacks significantly, while not significantly changing the elastic modulus.

Keywords: cellulose nanocrystals; lignin; nanofibers; electrospinning; dynamic mechanical analysis; nanoindentation; thermal-mechanical properties; lignin films

Publication Review Process: Formally Refereed

Date posted: 03/21/2014

This publication is also viewable on Treesearch:  view
RITS Product ID: 67309
Current FPL Scientist associated with this product
Jakes, Joseph
Research Materials Engineer
  

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