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Title: Soy flour dispersibility and performance as wood adhesive

Source: Journal of Adhesion Science and Technology Volume 27, Number 18-19, 2013; pp. 2043-2052.

Author(s)Frihart, Charles R.; Satori, Holly

Publication Year: 2013  View PDF »

Category: Journal Articles
Associated Research Project(s):   FPL-4707-1B

Abstract: Soy flour adhesives using polyamidoamine-epichlorohydrin (PAE) resin as the curing agent are being used commercially to make bonded wood products. The original studies on the soy-PAE adhesives used purified soy protein isolate, but the much lower cost soy flour is now used commercially. We examined the performance of commercially available soy flours that have their proteins either mainly in their native (90 protein dispersibility index (PDI)) or denatured (70 and 20 PDI) states. We expected that the more native state soy proteins with their better dispersibility would provide better adhesion to wood surfaces and enhanced reaction with PAE resin. Small-scale wood bonding tests showed that neither of these effects was observed without and with a low level of PAE. In these tests, the solids content of the soy formulations had a large influence on adhesive viscosity but little influence on bond strength. Additionally, little difference was observed in any of the adhesive or viscosity properties between the soy flours having either a 0.152 or 0.075mm (100 or 200 mesh) particle size.

Keywords: soy flour; dispersibility; bond strength; viscosity; particle size

Publication Review Process: Formally Refereed

File size: 197 kb(s)

Date posted: 09/13/2013

This publication is also viewable on Treesearch:  view
RITS Product ID: 65234
Current FPL Scientist associated with this product
Frihart, Charles R.
Research Chemist
  

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