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Madison, WI 53726-2398
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Title: High-Temperature Performance of Soy Adhesives

Source: Wood Adhesives 2009 / edited by Charles R. Frihart, Chiristopher G. Hunt, and Robert J. Moon.

Author(s)'Hunt, Christopher G.; O'Dell, Jane L.; Frihart, Charles R.

Publication Year: 2010  View PDF »

Category: Journal Articles
Associated Research Project(s):   FPL-4707-2A

Abstract: We investigated the likelihood of soybean-based adhesives passing the heat resistance requirement for structural adhesives. We evaluated the performance of soy adhesives up to a temperature of 230°C using ASTM 7247 (hot and cold shear blocks), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), and dynamic mechanical analysis (DMA). We found that pure soy flour performed relatively well at high temperature, and the addition of crosslinking agents generally improved performance. One commercial soy/phenol formaldehyde passed the standard test ASTM D7247.

Keywords: Soy flour, adhesives, testing, soybean glue, adhesion, glue, crosslinking, polymerization, soy proteins, phenols, thermal analysis, fire testing, composite materials, thermal properties, proteins, formaldehyde, temperature, thermogravimetry, calorimetry, high temperature, bonding, gluing, failure, durability, thermal degradation, fire resistance, fire hazard, ASTM standard D7247, flammability, dynamic mechanical analysis

Publication Review Process: Non-Refereed (Other)

File size: 223 kb(s)

Date posted: 11/26/2010
RITS Product ID: 36568
Current FPL Scientists associated with this product (listed alphabetically)
Frihart, Charles R.
Research Chemist
Hunt, Christopher G.
Research Chemist
 

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