18th International Nondestructive Testing and Evaluation of Wood Symposium September 24-27, 2013, Madison, Wis.

NDEcoverRegister now for the 18th International Nondestructive Testing and Evaluation of Wood Symposium. If you are involved or interested in nondestructive testing and evaluation of wood, wood-based materials and products, this event is for you.

The forum will bring together the international nondestructive testing and evaluation research community, including users of various nondestructive testing technologies, equipment development and manufacturing professionals, representatives from various government agencies, and other groups to share research findings and new nondestructive testing products and technologies.

The 18th Symposium also marks the 50th anniversary of the symposium series.  The first symposium was held at FPL in the fall of 1963. At that meeting, nearly 100 scientists, engineers, and industry leaders discussed the possibilities of a wide range of scientific means for testing wood nondestructively. Seventeen symposia have been held to-date at sites in China, Germany, Hungary, Switzerland and the United States.

Attendees will receive a complimentary electronic copy of a special publication in commemoration of the 50th anniversary of the first meeting. The publication includes a brief history of the symposium series, summaries of each symposium, and searchable electronic copies of the proceedings from each symposium.